Separating semiconductor chips from a wafer is an important step in the backend of semiconductor manufacturing. The new process from Lidrotec combines ablative laser dicing under a liquid stream with ...
Fonon Well-Positioned To Capitalize on Wafer Dicing Market Growth With BlackStar Laser Dicing System
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and additive ...
ORLANDO, Fla.--(BUSINESS WIRE)--Fonon Corporation, a multi-market holding company, R&D center, equipment designer and manufacturer of advanced laser material processing systems for subtractive and ...
So, you’re trying to figure out the whole silicon carbide wafer scene, huh? It’s a pretty big deal these days, especially ...
Dublin, Jan. 27, 2026 (GLOBE NEWSWIRE) -- The "Silicon Wafer Market Report 2026" has been added to ResearchAndMarkets.com's offering. The report offers comprehensive insights into market statistics, ...
The AVIA 355-23-250 UV laser is said to offer the highest pulse repetition rate of any Q-switched UV laser, allowing it to perform high-speed wafer-die singulation with high yields. The 355-nm laser ...
Experience PI’s new piezo wafer stages, granite-based multi-axis systems for thin film metrology, air bearing stages, laser beam steering systems, and sub-nanometer precision piezo stages, backed by ...
Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...
Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...
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